SK Hynix will invest 19 trillion won in a new advanced chip packaging facility in Cheongju to boost capacity for AI-driven ...

SK Hynix ( HXSC.F) plans to invest 19 trillion Korean won ($12.9 billion) to build a new advanced packaging plant in the ...

SK Hynix will invest 19 trillion Korean won to build an advanced packaging fab in Cheongju, North Chungcheong Province. On ...

In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

SK Hynix will invest 19 trillion won ($12.9B) in a new P&T7 advanced packaging hub in Cheongju to scale HBM3E and HBM4 output ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

The artificial intelligence (AI) revolution has expanded rapidly since 2023, powering applications from chatbots to ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta. G lobalFoundries (GF) plans to create a new center for advanced packaging ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

South Korean TC bonder (TCB) manufacturer Hanwha Semitech recently announced an organizational restructuring aimed at strengthening its development capabilities for next-generation... Despite flat ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant ...