SAN MATEO, Calif. — Stacked-die packaging — in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated — has taken root in the cell-phone handset market as ...

Intel Corp. said it has developed a method of stacking flash memory five dice high, as a way of increasing the memory found within cell phones and PDAs. Intel has developed a technology called ...

A growing trend among mobile-memory-system developers is to stack dice vertically in a package. Designers use this method to save board space on small pc boards, which increasingly find use in compact ...