Modern-day high-volume semiconductor manufacturing is a complex process that spans numerous stages and nodes. And with the ever increased focus on quality and cost, the manufacturing supply chain is ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Microelectronic device manufacturers can use the IRIS wafer-inspectionsystem from SemiProbe to detect flaws in the wafer circuit pattern, aswell as contamination or process damage. Depending on the ...

Known-good-die (KGD) sort is a commonly used technique in semiconductor processing that allows IC device engineers to bypass the packaging of defective semiconductor devices, saving time and money.

Numerous challenges have to be overcome during design and production of ICs below 90 nm. Manufacturing processes are still being characterized, and the interactions between the physical processes and ...