Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...