Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: Human-machine integration has been widely implemented in various fields, such as entertainment, human movement assistance, and rehabilitation. This study focuses on electrically-induced ...
Copyright 2026 The Associated Press. All Rights Reserved. Copyright 2026 The Associated Press. All Rights Reserved. Syringe exchange programs are struggling to stay ...
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