Abstract: With the miniaturization and high-power requirements of microelectronic devices, the current density carried by interconnects in packaging structures continually increases and reaches the ...
In a new study published in Defence Technology, a team of researchers from China introduced a framework that integrates finite-element simulation with ...
Abstract: Using COMSOL Multiphysics simulation software, the optimal distance between the middle guide ring of the magnet and the free surface under an applied CUSP magnetic field was analyzed.
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