A multi-disciplinary team of researchers linked atomic-scale features to efficient heat-to-electricity conversion, offering ...
Abstract: The main factor that drives the aging of power semiconductor modules is the thermally induced stress caused by the maximum temperature and temperature swings. This thermally induced stress ...
Abstract: Flip chip technology, as an important innovation in the field of semiconductor packaging, has received extensive attention and application in recent years. Currently, flip chip pull-off test ...
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