Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: This article develops two new algorithms of three-term conjugate gradient (TTCG) coefficients to handle nonlinear least-squares (NLS) problems using the structured secant equation. Motivated ...
This repository contains the implementation of the Scoop algorithm for profiling attacks against higher-order masking, as well as supplementary materials for additional figures and reproducing the ...
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