Patterning schemes, including multiple patterning and extreme-ultraviolet demonstrators using advanced low-k approaches, are important vehicles for exploring impacts on wire-signaling scenarios and ...

The 16nm FinFET process node is rapidly becoming the preferred choice for advanced Integrated Circuit (IC) designs. The 16nm node’s lower standby leakage characteristics and increased drive strength ...

RC delay issues grow in the back-end-of-the-line over the next couple of process nodes; possible solutions include new materials, new processes and stacked die. It’s becoming apparent that traditional ...

The semiconductor industry faces enormous challenges in virtually every field. Thanks to a recent advance in interconnect technology from Applied Materials, we should manage to squeeze a few more ...

Integrated circuit (IC) designers move to advanced process technology nodes to leverage higher performance, density, and functionality, as well as reduced delay and power consumption, enabled by ...