Semiconductor Engineering

Sparse Finite Element Problems on Neuromorphic HW (Sandia National Lab)

A new technical paper titled “Solving sparse finite element problems on neuromorphic hardware” was published by researchers ...
Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
IEEE

Magnetomechanical Multiscale Hysteresis Model of Electrical Steel Sheets in the Finite Element Simulation of a Transformer

Abstract: In this article, a multiscale model incorporates an energy-based hysteresis model for ferromagnetic material. The coherent rotational phenomena are considered by letting the magnetic domains ...
IEEE

Simulation to Analyzing Vibrations of Human on Full Model 3-D in Finite Element Method

Abstract: This study explores the vibration characteristics of car seats and the human body using finite element (FE) modeling and numerical simulation to improve passenger comfort during vehicular ...
Investopedia

Death Benefit Taxation and Claims: A Guide for Beneficiaries

Adam Hayes, Ph.D., CFA, is a financial writer with 15+ years Wall Street experience as a derivatives trader. Besides his extensive derivative trading expertise, Adam is an expert in economics and ...
Frontiers

Biomechanical analysis of ponte osteotomy and PSO osteotomy in the treatment of ankylosing spondylitis with thoracolumbar kyphotic deformity

Department of Spinal Surgery, Sixth Affiliated Hospital of Xinjiang Medical University, Ürümqi, China Background: Ankylosing spondylitis (AS) commonly progresses to thoracolumbar kyphosis. Pedicle ...
GitHub

Spectral neighbor analysis potential

This repository contains spectral neighbor analysis potential (SNAP) models for various elements, including the force field models, the corresponding parameters and training data used to develop the ...