Abstract: In this paper, we propose a novel post-bond through-silicon via (TSV) test method for post-bond TSV manufacture test. The proposed method can measure the RGC parameters of TSVs using ...
Abstract: In this paper we present the design and experimental evaluation of an an 8-bit adiabatic multiplier with built-in self-test (BIST) logic and an internal single-phase sinusoidal power-clock ...
There is a necessity to address the motivations for this project. TensorFlow is one of the deep learning frameworks available with the largest community. This repository is dedicated to suggesting a ...
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