Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
The Standardisation Group for Embedded Technologies (SGET) heralds a paradigm shift in embedded design: With the publication ...
A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...
Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series ...
Lanner Electronics, a developer of rugged Edge artificial intelligence (AI) hardware, has launched the EAI-I351, a robotic AI ...
Workload consolidation has massive benefits, but implementation concerns have held back OEMs. Pre-integrated hardware and ...
DeepCool’s CL6600 is a new mid-tower chassis built around a simple thermal premise: stop CPU and GPU heat from sharing the ...
Explore how repairable electronics, modular tech, and growing right to repair laws are reshaping consumer devices, reducing e ...
Add to this the question of energy, and it's clear that the requirements for a true AI PC are more than just a blisteringly ...
Chiplets promise a way to deliver steady increases in compute capacity and I/O bandwidth by mixing and matching multiple dies (also called chiplets) to rapidly build larger, more powerful ...
Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
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