Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
The Standardisation Group for Embedded Technologies (SGET) heralds a paradigm shift in embedded design: With the publication ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
Workload consolidation has massive benefits, but implementation concerns have held back OEMs. Pre-integrated hardware and ...
After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series ...
The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) ...
DeepCool’s CL6600 is a new mid-tower chassis built around a simple thermal premise: stop CPU and GPU heat from sharing the ...
ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.
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