Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Abstract: In this letter, we first investigate a shift strategy for enhancing the length of the consecutive segment in the sum and difference co-array (SDCA). Then, a fourth-order sparse antenna array ...
JOHOR BAHRU, Malaysia -- Eric Yong has not enjoyed a proper weekend for a long time. A senior business development manager for engineering services company CNMy in Malaysia, Yong said he even had to ...
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