As Intel's nda breaks, we are now allowed to show you the upcoming boards we are going to review from ASUS, msi and GIGABYTE.

Among high-frequency laminates, Rogers Corporation materials are widely regarded as industry benchmarks. Three laminates in particular—RO4350B, RO4003C, and RO3003—are frequently selected for RF, ...

HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...

Learn more about whether Nayax Ltd. or TTM Technologies, Inc. is a better investment based on AAII's A+ Investor grades, ...

The Godox iT32 flash and X5 wireless trigger join together with magnetic attraction but additional triggers make dedicated ...

As part of the BEYOND5 project, CEA-Leti was responsible for developing a RF power module (FEM) combining three essential RF functions: a power amplifier (PA), which amplifies transmitted signals; a ...

Mouser Electronics, Inc. has released a new eBook that delves into key radio frequency (RF) design topics ranging from signal ...

Abstract: This paper presents an in-depth evaluation of the reconfigurable and agile RF front-end (RFFE) architecture, previously demonstrated in laboratory settings through real-world flight tests.

The Ebook delves into key radio frequency (RF) design topics ranging from signal chain fundamentals and antenna selection to ...