Science Daily

This tiny power module could change how the world uses energy

As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...
IEEE

SiC Power Module Packaging Using Printed Electronics Materials and Processes

Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...
Electronic Design

UHV SiC Devices Geared Toward Mission-Critical Energy Infrastructure Apps

The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...
IEEE

Input Admittance Analysis of SEPIC Power Factor Correction Grid-Connected Rectifier

Abstract: This paper validates the input admittance of a SEPIC power factor correction (PFC) rectifier derived from an average model and a switching model. The SEPIC PFC rectifier is implemented and ...