A new technical paper titled “3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and Universidad Complutense de Madrid.

Leveraging the power of automation for more connected, efficient, smarter sheet metal operations, Lantek launches v.45 of its ...

Create a new conda environment from the provided enviroment.yml file. conda env create --name mint --file=environment.yml Activate the enviroment and install the package from source. conda activate ...