Discover the sustainable innovations shaping the campus of 2035 through clean energy, zero waste, and regenerative living ...
Japanese battery innovators are racing to solve the slow‑charging bottleneck that still frustrates drivers and device makers, ...
A new technical paper titled “3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and Universidad Complutense de Madrid.
A nuclear thermal propulsion engine could cut the travel time in half for future space explorers racing to the Red Planet.
For the past few weeks, I've been testing the Dell Pro Max 14 Premium, the HP ZBook X G1i 16, and the Lenovo ThinkPad P16 Gen 3. Here's what IT pros need to consider before buying.
Abstract: Electrical machines (EMs) in electromechanical actuators (EMAs) need to be highly reliable, especially when driving safety-critical systems in more electric aircraft (MEA). However, the ...
Abstract: Chiplet-based heterogeneous integration, exemplified by CoWoS packaging, delivers high scalability and performance but introduces critical thermal challenges from power density escalation ...