Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
A new technical paper titled “3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and Universidad Complutense de Madrid.
James has been writing about technology for years but has loved it since the early 90s. While his main areas of expertise are maker tools -- 3D printers, vinyl cutters, paper printers, and laser ...
"KABLOOEY!" — That’s how USGS scientists described the jaw-dropping muddy eruption at Yellowstone’s Black Diamond Pool, and luckily, this time it was caught on camera! Recorded in Biscuit Basin under ...
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