Abstract: This article presents a novel millimeter-wave (mm-wave) single-chip gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) transmit–receive (T/R) front-end for 5G-NR FR2 ...
Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...
If you talk to almost any embedded team, they’ll tell you they want more code reuse. Reusable drivers. Reusable middleware. Reusable services. Reusable “platforms.” But when you look at most real ...
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