Our paper provides an overview of the code, features, and examples for the first released version of the application (1.0.11.0). For newer versions, please refer to the examples in the viewer ...
Abstract: Heterogeneous 2.SD/3DIC integration is becoming more and more popular and important since device scaling and process shrink are becoming more and more difficult and expensive. This lecture ...
Abstract: 2.5D “Chiplet” approaches allow for a dense integration of independently designed & fabricated ICs. However, this inherently adds a significant interconnect latency, therefore limiting the ...
Forward-looking: Modern data storage has a short lifespan. Hard drives fail, SSDs wear out, and even magnetic tape needs periodic rewriting to avoid degradation. Now, an ambitious technology is aiming ...
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