Abstract: The paper presents the development of an algorithm for generating a non-uniform hexahedral computational mesh suitable for use with the finite difference time domain (FDTD), finite ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
X-ray tomography is a powerful tool that enables scientists and engineers to peer inside of objects in 3D, including computer ...
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