Abstract: Embedded Multi-die Interconnect Bridge (EMIB) packaging technology has been being widely adopted in Intel's FPGA, Server CPU, GPU, and data centric high-performance compute (HPC) segments ...

Tencent is accessing Nvidia's most advanced Blackwell AI processors through a cloud computing arrangement in Japan, even as U.S. policy restricts the sale of such chips to China, the Financial Times ...

Renowned AI scientist Yann LeCun confirmed on Thursday that he had launched a new startup — the worst-kept secret in the tech world — though he said he will not be running the new company as its CEO.