Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
With the development of modern industrial automation, orbiting inspection equipment is widely used in electric power, petroleum and chemical industries. However, accurately acquiring and predicting ...
SHENZHEN, China, Dec. 22, 2025 (GLOBE NEWSWIRE) -- MicroCloud Hologram Inc. (NASDAQ: HOLO), (“HOLO” or the "Company"), a technology service provider, launched a brand-new FPGA-based quantum computing ...
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