Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...
Abstract: This article proposes a framework for multiphysics modeling and co-simulation of electrified ships, aimed at system-level verification. The framework encompasses the development of dynamic ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback