Joint Work Shows Next Generations of RF and Optical Front-End Modules (FEM) Could Be Built by the Assembly of Different Silicon Technologies at Wafer Level, Allowing the Dense Co-integration of ...

DroneScan3D attached to a drone, which is not included with the instrument. As more tower sites adopt drones for maintenance tasks, one amateur radio operator has designed a field strength instrument ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...

Git isn’t hard to learn. Moreover, with a Git GUI such as Atlassian’s Sourcetree, and a SaaS code repository such as Bitbucket, mastery of the industry’s most powerful version control tools is within ...

In this post, we are going to discuss the best free 3D file viewer software for Windows 11/10. Using these free software, you can easily view a variety of 3D files. Some of the commonly supported 3D ...

In this blog, we will discuss how Keysight RF Circuit Simulation Professional revamps RF circuit simulation and optimization. Discover how to achieve efficient, accurate designs for even the most ...

Forbes contributors publish independent expert analyses and insights. Tim Newcomb covers tennis gear/business, stadiums and shoe tech. During the Wilson and Roger Federer launch of the signature RF 01 ...

In a leap forward for miniaturized electronics, researchers have unveiled a groundbreaking method to fabricate high-aspect-ratio 3D microstructures with sub-10 micron resolution – tackling one of the ...

Researchers have found a way to produce far smaller 3D-printed RF components. Currently, there are limitations in 3D printing vertical structures with high aspect ratios. This geometry is often used ...

Researchers developed a hybrid method to build precise 3D RF microstructures, boosting performance, tunability, and cutting device size by up to 45%. (Nanowerk News) In a leap forward for miniaturized ...

In a leap forward for miniaturized electronics, researchers have unveiled a groundbreaking method to fabricate high-aspect-ratio 3D microstructures with sub-10 micron resolution—tackling one of the ...