Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...
Abstract: The need to train the next generation of embedded systems (ESs) engineers with relevant skills across hardware, software, and their co-design remains pressing today. This letter describes ...
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