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MIT’s chip stacking leap could slash energy use for hungry AI chips

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
Live Science

MIT's chip stacking breakthrough could cut energy use in power-hungry AI processes

Engineers from MIT say that stacking circuit components on top of each other could be the answer to creating more ...
IEEE

Structural and Device Considerations for Vertical Cross Point Memory with Single-stack Memory toward CXL Memory beyond 1x nm 3DXP

Abstract: In this paper, we propose the structure of the 3D vertical cross point memory (3DVXP) having byte-addressability and discuss the possible challenges and requirements from the structural ...