The Standardisation Group for Embedded Technologies (SGET) heralds a paradigm shift in embedded design: With the publication ...

Innodisk has launched its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI ...

Today James takes a look at the £220 Big Chungus V2 - the new version of the 'Fat Rabbit' case. Sadly, this chassis isn't without problems as James explains in some detail in our video today. 00:00 ...

Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series ...

Explore how repairable electronics, modular tech, and growing right to repair laws are reshaping consumer devices, reducing e ...

All modules represent a significant advancement in edge AI computing. They offer up to 16 cores with up to 10 TOPS, feature an integrated NPU5 for low-power AI inference with up to 50 TOPS, and can ...

HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...

Open. Choice. Outcomes. Versatility New Construction. Retrofit. Equipment. Systems Niagara Embedded. Niagara Native ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...

The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) ...