Learn what ASICs are and how hardware companies use them to improve performance and reduce energy consumption.

Chiplets enable scalability but dramatically raise interconnect complexity and risk. Silicon-proven NoC technology is the key ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Because no single software can meet every need or workflow, integrated ecosystems have become essential. In this interconnected landscape, architects move between AI, interoperability challenges, and ...

Samsung has released a series of official videos for its new Galaxy XR headset, offering promos, unboxings, and detailed how-to guides. The videos highlight the headset’s AI-powered experiences, setup ...

Apple has bought IC Mask Design, a firm specializing in the layout of chips and processors. Apple is continuously acquiring companies, and most recently appears to have been buying ones concerned with ...

What if the key to building AI systems that are not only powerful but also trustworthy lies in a set of repeatable design principles? As artificial intelligence continues to shape industries and ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Looking to build an Agentic AI solution in the cloud but don't want to create your own AI model from scratch? Amazon Bedrock is the cloud computing service you're looking for. In this quick Amazon ...