Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Vince Zampella, the co-creator of Call of Duty, founder of Respawn Entertainment, and head of EA's Battlefield franchise died in a car crash on December 22nd. He was 55 years old. "We're heartbroken ...
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