With the rapid economic development, the number of constructed bridges has surged globally. These structures inevitably ...

Abstract: The traditional current-type flexible arc suppression method fails to account for the impact of line voltage drop, resulting in residual current during grounding fault suppression. To ...

Abstract: Three-dimensional integrated circuits (3-D ICs) based on through-silicon via (TSV) have helped to improve the transistor density and are considered as an important technology supporting ...