Abstract: We analyze the current way of producing safety-critical software and the reference safety and assurance standards in the domain of spacecraft, namely, ECSS-Q-ST-80C and ECSS-E-ST-40. Then, ...
Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
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