Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: This letter proposes a single-sensor, non-invasive method for simultaneous estimation of core temperature and power loss in electrolytic capacitors, eliminating the need for equivalent ...
ABSTRACT: This paper investigates the computational solution to the problem of projectile motion under a significant linear drag effect. The drag force acting on the particle within the medium of ...
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