Amphenol RF has expanded its portfolio of pre‑configured cable assemblies with the introduction of new MMCX straight and ...
Compex has been a Qualcomm Authorized Design Centre (ADC) since 2014, helping customers design specialized, ...
Dracula Tech's next-gen light energy-harvesting OPV platform delivers a 30% performance increase for battery-free IoT.
The Standardisation Group for Embedded Technologies (SGET) heralds a paradigm shift in embedded design: With the publication ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
ESP32-E22 Wi-Fi 6E is Espressif’s first tri-band Wi-Fi 6E co-processor, adding dual-mode Bluetooth and offloading protocol ...
Bel Fuse Inc. (Nasdaq: BELFA and BELFB) ('Bel” or 'the Company”), a leading global manufacturer of products that power, ...
With a pair of new releases, Telit Cinterion demonstrates how the convergence of advanced 5G modules and smarter AI platforms ...
Among high-frequency laminates, Rogers Corporation materials are widely regarded as industry benchmarks. Three laminates in particular—RO4350B, RO4003C, and RO3003—are frequently selected for RF, ...
Wolfspeed’s 300mm platform will unify high-volume silicon carbide manufacturing for power electronics with advanced ...
Bel Fuse Inc. (Nasdaq: BELFA and BELFB) (“Bel” or “the Company”), a leading global manufacturer of products that power, ...
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