Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: Combining antenna arrays with physical reconfigurability (i.e., origami) allows for additional degrees of freedom in operation and enables larger structures to be folded into smaller volumes ...
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SINGAPORE, Dec 17 (Reuters) - In a high-security Shenzhen laboratory, Chinese scientists have built what Washington has spent years trying to prevent: a prototype of a machine capable of producing the ...
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