eSpeaks’ Corey Noles talks with Rob Israch, President of Tipalti, about what it means to lead with Global-First Finance and how companies can build scalable, compliant operations in an increasingly ...

Even without clean fleet tax credits and cash-on-the-hood incentives, fleet managers are working hard to maximize their ROI on vehicle assets and reduce their total cost of ownership – and they’re ...

Abstract: “Active flux” is an alternative unitary concept for the control of practically all ac drives. As aligned to rotor d-axis (for synchronous and flux-modulation machines) and to rotor flux axis ...

Following AI-powered live translation and language practice capability, Google Translate is adding a model picker with “Fast” and “Advanced” options. This model picker appears beneath the “Google ...

Whoop’s ambitious Advanced Labs feature appears to be nearing its global rollout, according to users on Reddit. Many members outside the US, including in Europe, the Middle East, and Asia, claim to ...

Microsoft has announced that SQL Server Integration Services (SSIS) is now officially supported in the latest SQL Server Management Studio (SSMS) 22 Preview 3. This release is quite important for ...

Whoop has officially announced that Advanced Labs, its service that integrates blood biomarker testing directly into the platform, is now live in the United States. When we first analyzed the service ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs ...

Faster, more intuitive web interface with integrated search, improved visual organization and unified configuration/diagnostic tools eliminate time-consuming ...

A technical paper titled “Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications” was published by researchers ...