Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...
Abstract: System-in-package (SiP) is an advanced packaging technology that integrates multiple chips and components into a single package, creating a highly integrated system. Integrated Passive ...
A comprehensive educational package for learning Stable Diffusion and advanced generative AI models. This repository provides implementations, tutorials, and practical applications for understanding ...
gollm is a Go package designed to help you build your own AI golems. Just as the mystical golem of legend was brought to life with sacred words, gollm empowers you to breathe life into your AI ...
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