Talc-based makeup and powders will not go through new asbestos testing requirements after the U.S. Food and Drug Administration (FDA) chose to pull back a proposed rule last week. Multiple schools and ...

Today we're doping silicon wafers with a phosphoric acid and a fiber laser. US officials warn snowbirds of 'violent crime' in winter destination hot spot Fox News poll spells bad news for Donald Trump ...

The Trump administration took another step Tuesday to weaken protections for Americans with medical debt, issuing new guidance that threatens ongoing state efforts to keep that debt off consumers’ ...

With the cost of health insurance set to rise, some Americans are asking a surprising question: Is it actually cheaper to get medical care without it? The short answer: Sometimes. But not often. And ...

Several new medical schools are opening across the U.S., reflecting continued efforts to address physician shortages, expand access to training and meet local workforce needs. Below are eight new ...

Thousands of UK claimants have filed legal action against US pharmaceutical and cosmetics giant Johnson & Johnson alleging people diagnosed with cancers were exposed to asbestos in its talcum powder, ...

OpenEvidence Inc., the developer of an artificial intelligence search engine for doctors, today announced that it has closed a $200 million investment. The Series C round was led by Alphabet Inc.’s GV ...

Elemento is the director of the Englander Institute for Precision Medicine at Weill Cornell Medicine. Sternberg is the clinical director of the Englander Institute for Precision Medicine. Khozin is ...

Abstract: A HfO2 -SiO2 hybrid bonding technology applied for three-dimensional memristor integration is developed, and the bonding mechanism is deeply studied. This bonding method mainly includes ...

This list includes medical groups in Silicon Valley. Information was obtained from company representatives, the State of California Office of the Patient Advocate, and SVBJ research. Silicon Valley is ...

Abstract: Through-silicon via (TSV) as a crucial interconnection microstructure in three-dimensional (3D) chip, have significantly enhanced device performance and reliability. However, the increasing ...