Abstract: Encapsulation is gaining relevance for the miniaturization of power modules to enhance dielectric, mechanical, and thermomechanical reliability. Capillary underfill is a flexible method for ...
Abstract: In this paper, we use an automated tool flow in a 14 nm CMOS fin-shaped field-effect transistor (FinFET)/ static random access memory (SRAM) simulation-based design-technology cooptimization ...
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