Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...
The simulation hypothesis—the idea that our universe might be an artificial construct running on some advanced alien computer—has long captured the public imagination. Yet most arguments about it rest ...
Abstract: Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distortion requirements are needed to ensure ...
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