Our paper provides an overview of the code, features, and examples for the first released version of the application (1.0.11.0). For newer versions, please refer to the examples in the viewer ...

Note: This package is available as a prerelease, so it is not ready for production use. The features and documentation in this package might change before it is verified for release.

When Sam Darnold threw his second interception Thursday night, there was no reason to believe the Seattle Seahawks could come back. The Los Angeles Rams had clearly been the better team. Darnold was ...

Abstract: The demand for high-performance semiconductor products in line with the development of information technology industry continues to increase. However, fab node shrinkage, which led the ...

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

Abstract: Advances in the high performance computing (HPC) lead to a new frontier of the fan out wafer level packaging (FOWLP) development. To provide a solution of cost-attractive package for ...

Forward-looking: Modern data storage has a short lifespan. Hard drives fail, SSDs wear out, and even magnetic tape needs periodic rewriting to avoid degradation. Now, an ambitious technology is aiming ...